PRESS RELEASE AIM Solder’s New NC259FPA Ultrafine No Clean Solder Paste Wins Circuits Assembly NPI Award April 16, 2024 – Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce that its groundbreaking product, NC259FPA Ultrafine No Clean Solder Paste, has been honored with the 2024 Circuits Assembly NPI Award for solder materials. This accolade is a testament to AIM Solder’s commitment to innovation and excellence in the electronics manufacturing industry. The NC259FPA is a zero-halogen solder paste, specifically engineered to meet the demanding requirements of miniLED, microLED, die attach, micro BGA, and HDI board applications. Its formulation allows for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter, setting a new industry standard in miniaturization and precision. Key features of the NC259FPA Ultrafine No Clean Solder Paste include: Excellent Wetting: Ensures strong, reliable joints for long-term performance. High Transfer Efficiency: Optimizes material usage and reduces waste, making it a cost-effective solution. High Reliability: Meets the rigorous standards required in high-performance electronics manufacturing. High Tack Force for Mass Transfer: Ideal for intricate miniLED and microLED applications. “We are incredibly proud to receive the 2024 Circuits Assembly NPI Award,” said Timothy O’Neill, Director of Product Management at AIM Solder. “This award is a reflection of our team’s hard work, dedication, and relentless pursuit of excellence. We remain committed to providing our customers with superior products and services, and this recognition further motivates us to continue innovating and exceeding industry standards.” For more information about AIM Solder’s NC259FPA Ultrafine No Clean Solder Paste and other products, please visit www.aimsolder.com. |